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貝格斯 Bond-Ply LMS-HD，Bond-Ply LMS-HD

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貝格斯 Bond-Ply LMS-HD

點和優(yōu)點

導熱系數(shù)：1.4W

墊片材料厚度：0.254mm/0.305mm

阻燃等級：V-O

連續(xù)使用溫度：-60℃+180℃

特殊的介電強度

非常低的界面電阻

消除機械緊固件

Bond-Ply LMS-HD導熱熱固性層壓材料。產品由高性能熱導電低模量有機硅化合物涂層在固化的核心，雙內襯保護膜。

低模量硅酮設計有效吸收機械應力裝配水平的CTE失配引起的沖擊和振動，同時提供卓越的熱性能（與PSA技術）和長期誠信。

Bond-Ply LMS-HD將通常被用于結構動力秉承組件和印刷電路板的散熱片。

典型的應用包括：離散半導體封裝粘結到散熱器或散熱片

性能：配置可用

        軋輥形式

        切件

        表格形式

保質期：粘結層lms-hd是熱固化材料，應存放在溫度控制的條件。建議儲存溫度范圍為5-25°C應該用來維持5個月保質期的最佳特性。

Typical Properties of Bond-Ply LMS-HD
Property	Imperial Value	Metric Value	Test Method
Color	Yellow	Yellow	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	***
Thickness (inch) / (mm)	0.010, 0.012	0.254, 0.305	ASTM D374
Continuous Use Temp (°C) / (°F)	-76 to 356	-60 to 180	***
Adhesion
Lap Shear @ RT (psi) / (MPa) (1)	200	1.4	ASTM D1002
Electrical		Value	Test Method
Breakdown Voltage, Sheet (Vac) (1)		5000	ASTM D149
Breakdown Voltage, Laminated (Vac) (2)		4000	ASTM D149
Dielectric Constant (1000 Hz)		5.0	ASTM D150
Volume Resistivity (Ohm-meter)		1011	ASTM D257
Flame Rating		V-O	U.L. 94
Thermal
Post-Cured Thermal Conductivity (W/m-K) (3)		1.4	ASTM D5470
Thermal Performance vs Lamination Method

Lamination Pressure (75 psi) (4)	Constant	IPO
TO-220 Thermal Performance (°C/W)	2.1	2.3
1) The ASTM D149 test method on cured LMS-HD material. No pressure was applied to the LMS-HD during the cure cycle. 2) A 1/2" diameter probe was laminated with LMS-HD to a 2" X 2" plate at 200 psi for 30 seconds, then cured with no pressure at 160°C for 6 minutes. The cured assembly was then tested per ASTM D149. This LMS-HD sample resembles a typical lamination application. 3) The ASTM D5470 (Henkel Modified) test procedure was used on post-cured LMS-HD material. The recorded value includes interfacial thermal resistance. These values are given for customer reference only. 4) TO-220 Thermal Performance testing, per The Henkel RD2010 specification for Laminates, was completed on laminated TO- 220 assemblies. Lamination was completed at 75 psi for 30 seconds for "IPO" (Initial Pressure Only) and at a constant 75 psi during the lamination and curing process for "Constant". No additional pressure was applied during TO-220 thermal performance testing.